职位描述
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Summary:
Provide bumping total solution; includes but not limited to new bumping process, bumping mask design, layout, development, and handle the relevant design rules.
RESPONSIBILITIES:
1. Be familiar with various bumping and WLCSP processes and procedures.
2. Coordinate with DE to select the correct bumping process. Coordinate with the layout engineer to review the bumping mask drawings and assure them to meet the package design rules.
3. Cooperate with bumping house to complete the design of bumping mask in bumping house.
4. Coordinate with internal teams to identify the bumping related issues, address the root cause and find the solutions.
5. Summarize the experience of bumping design, bumping process and maintain the design rule.
6. Cooperate with bumping team, be responsible for the introduction and verification of new bumping processes.
7. Perform other tasks assigned by superior.
REQUIREMENTS:
1. Have experience on bumping mask design or bumping process;
2. Be proficient in AutoCAD, Visio, Klayout.
3. Good knowledge of bumping process;
4. Bachelor degree with 1-3 years related experience.
工作地点
地址:成都郫都区郫都区成都高新综合保税区B区


职位发布者
孙莉君/..HR
成都芯源系统有限公司

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电子技术·半导体·集成电路
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1000人以上
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公司性质未知
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高新区综合保税区科新路8号
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